Shift Process Engineer

Job Context

This role is part of the Fab Engineering team and the Technical Operations team supporting the business in delivering products within set parameters and time frames. The role requires the post-holder to work within the clean room as well as lab areas, to maintain, develop and deliver process solutions with a specific emphasis on providing a broad support from process engineering during shift operations (both in & out of normal day-time hours). Processing of manufacturing, engineering development and experimental batches with technician support may also be require

Main Responsibilities

First point of contact for all front face wafer fab process related issues occurring during out-of-hours shift operation;

To work closely with equipment engineering and operations teams to restore down process back to production

Deploy and review effective statistical control of processes to ensure a stable and robust processing platform

Provide effective handover to/from day shift process engineer

Provide technical expertise to project teams

In addition, there may be a requirement to:

Work with equipment engineering to plan, procure and qualify new process equipment to meet the process capability requirements that are demanded by product and technology roadmaps.

Use experience and knowledge to develop processes that are capable of meeting the product specification with high yields and low cost by employing design for manufacture.

Support development of new device processes to meet product and technology roadmap requirements

Report technology development status

Ensure effective transfer to manufacturing to enable ramp ahead of demand both at CIP and offshore for volume production

Provide process documentation and training to other members of staff including other engineers and technician/operators

Any other ad-hoc duty as requested by the Fab Engineering Manager

Skills/Qualifications

Essential

Track record of process ownership in a semiconductor wafer fab

Broad knowledge of fab process including photolithography, wet etch, dry etch, CVD dep, metals and thinning

Knowledge of SPC and 6 techniques, in particular first response to out of control/spec events

Degree in relevant subject, Physics, Chemistry, Material Science, Chemical Engineering, Electronic Engineering etc.

Desirable

Above undergraduate, preferably a PhD in relevant subjects.

Proven ability to work under own initiative with attention to detail and

Project People is acting as an Employment Agency in relation to this vacancy.