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Principal Chip Design Engineer

Job Title: Principal Chip Design Engineer
Contract Type: Permanent
Location: Suffolk, England
Salary: Negotiable
Start Date: ASAP
REF: AT - PCDE_1528907481
Contact Name: Adam Thompson
Contact Email:
Job Published: 9 months ago

Job Description

Principal Chip Design Engineer

My client are a leading global ICT infrastructure solutions provider, who have established end-to-end capabilities and strengths across the carrier networks, enterprise, consumer, and cloud computing fields.

They are developing leading edge optoelectronic devices for the next generation of communications networks and require a Transfer Printing Process Engineer for their expanding technical team and wafer fabrication facility.

They currently require a Principal Chip Design Engineer to develop highly reliable high-power 980-nm pump laser chip products of EDFA for the rapidly growing fields of optical fibre communication.

This role offers a fantastic opportunity to work with a highly innovative organisation, with a competitive salary and benefits package attached that includes:

  • Healthcare
  • Pension
  • Annual bonus equivalent of 2 months' salary
  • Relocation package on offer if required

Main Responsibilities

  • Design of highly reliable high-power 980-nm pump laser chip (cooled/uncooled)
  • Analysis of 980-nm pump chip concepts through theoretical and/or computational models
  • Fabrication and detailed characterization of prototype chip
  • Design and qualification of the chip fabrication processes
  • Maintaining up-to-date knowledge in areas of expertise and using the knowledge to promote continuous improvement in the work
  • Any other ad hoc duty as requested by the Project Manager.



  • Research and development experience in GaAs chip design & layout for 980-nm.
  • Solid knowledge of Physics of GaAs chip and Physics and Chemistry of material.
  • Familiar with GaAs Fab equipment and processing.

Project People is acting as an Employment Agency in relation to this vacancy.