Principal Chip Design Engineer

Principal Chip Design Engineer

My client are a leading global ICT infrastructure solutions provider, who have established end-to-end capabilities and strengths across the carrier networks, enterprise, consumer, and cloud computing fields.

They are developing leading edge optoelectronic devices for the next generation of communications networks and require a Transfer Printing Process Engineer for their expanding technical team and wafer fabrication facility.

They currently require a Principal Chip Design Engineer to develop highly reliable high-power 980-nm pump laser chip products of EDFA for the rapidly growing fields of optical fibre communication.

This role offers a fantastic opportunity to work with a highly innovative organisation, with a competitive salary and benefits package attached that includes:

• Healthcare
• Pension
• Annual bonus equivalent of 2 months' salary
• Relocation package on offer if required

Main Responsibilities

• Design of highly reliable high-power 980-nm pump laser chip (cooled/uncooled)
• Analysis of 980-nm pump chip concepts through theoretical and/or computational models
• Fabrication and detailed characterization of prototype chip
• Design and qualification of the chip fabrication processes
• Maintaining up-to-date knowledge in areas of expertise and using the knowledge to promote continuous improvement in the work
• Any other ad hoc duty as requested by the Project Manager.

Skills/Qualifications

Essential

• Research and development experience in GaAs chip design & layout for 980-nm.
• Solid knowledge of Physics of GaAs chip and Physics and Chemistry of material.
• Familiar with GaAs Fab equipment and processing.

Project People is acting as an Employment Agency in relation to this vacancy.